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O chip ou processor it is considered the “heart” of any electronic device, including computers. Generally, we only know the essential information about that component, such as maximum processor speed, business model, and some other technologies, for example. However, before reaching consumers, it has to face a rigorous and complex manufacturing process. 514z2b
To explain the details, the showmetech was invited by Intel to meet the Fab28, one of the company's main facilities in Kiryat Gat, Israel. Next, we'll show you the steps needed to build a computer chip.

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The first step in manufacturing a computer chip is creating the circuit diagram. Designers and engineers elaborate a kind of drawing that determines the position of each part inside the U, being extremely important to decide the amount of cache memory, memory levels, frequencies and other details.

To accomplish this task, those involved need to have an advanced knowledge of which existing components/technologies can be used to generate a functional and viable diagram for manufacturing. In addition, engineers must also plan the U design well in advance, as it may not be commercialized until a few months later.
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Did you know that the raw material of the U is the sand? Before going through several processes to become an intelligent component, this material is collected by the manufacturers because it has 25% silicon in its composition, a key element for the manufacture of computer chips.

As much as it is possible to use other elements, such as the gallium, for example, most companies choose this chemical component due to the low cost and the ease of obtaining it, since sand can be found in abundance on our planet.
Purification e3j44
After extracting the silicon from the sand, it is necessary to purify it to the maximum so that it reaches its best quality and avoids problems during manufacturing. To give you an idea of the importance of this process, the purity level should be at 99,9999999%. In other words, out of every 1 billion atoms, only one might not be made of silicon.

Purification takes place using a kind of oven, which subjects the element to high temperatures to eliminate impurities and leave it in its purest form. Then the material is cooled and molded into a cylindrical shape (called an ingot) with an average weight of 100 kg.
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Silicon ingot is heavy and would not be useful in this format. Therefore, manufacturers have to cut it into slices to obtain small disks known as wafers. The size of the layers changes as required by the manufacturer. THE Intel, for example, it adopts a standard of 30 cm in diameter.
After cutting, these slices receive a special polish and some chemical treatments to make them ready for the next step. From this moment on, the environment needs to have perfect hygiene to prevent dust particles and other residues from reaching the wafers.
Labs for chip manufacturing, known as “clean rooms,” are up to 10 times cleaner than an operating room. Employees and visitors must wear a special attire, which includes gloves, a mask, eyewear and foot protection, for example, all to avoid contamination of parts.

Photolithography 4wy6i

After making sure that the wafers are properly “pure”, companies start the process of photolithography. At this stage, the disk receives a photo-resistant material that, when hit by ultraviolet light, transfers the circuit diagram to the part.
It works like this: the light es over the “map” of the circuit that reflects the design on a lens. Once this is done, this same lens reduces the size of the diagram so that the scale is reduced with extreme perfection and reaches the size chosen by the manufacturer.

In the end, the reflected light is recorded in the wafer and the exported parts become malleable and can be removed using a specific fluid to generate small grooves for the transistors. This etching process, called a “masking,” gives the chip its form and functionality.
The next step is to enter the electrical properties of the transistors. Thanks to the semiconductivity of silicon, companies are able to change the conductivity of the element to modify the atoms and insert them into the structure of the wafer. Initially, these atoms are arranged randomly, but after being subjected to high temperatures, they start to adopt a fixed position in the disk structure.
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Before copper is added to the wafer, a thin layer of protection is applied to prevent short circuits. Then, this material is inserted to fill the empty spaces of the part and interconnect the billions of transistors, thus ensuring fast and accurate communication.
It is worth mentioning that, throughout the manufacturing process, there is a specialized team that analyzes each step using a high quality microscope or computerized systems. In this way, it is possible to check the structure of the transistors to make sure that they do not have defects.

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The final step in chip manufacturing is to insert s into the back of the wafer and break it up into smaller pieces known as matrices, which after being tested, go through a last cutting process to only then generate individual chip units.
However, these components are not yet properly a U, but just a the, which need to be “glued” on a metallic base called substrate. The part, which is the underside of the chip, is responsible for interconnecting the internal circuits with the components of the motherboard. At the top, there is another metallic item that serves to dissipate heat — it can also be used as a “billboard” to stamp the model and manufacturer's name, for example.

After the entire assembly process, the chips are tested to ensure their functionality and quality. If everything goes as expected, they can now be sent to the manufacturer's partner companies that, in a short time, will make computers with new hardware available to consumers.
See also:
Because the processor is the most important component in computing.
Sources: History-Computer, ComputerWorld, MyBroadBand.