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This Tuesday (9), the Qualcomm attended the Embedded World 2024, with new features that promise to further accelerate the evolution of artificial intelligence, the Internet of Things (IoT) and innovations in various industries. With more than 35 companies using its platforms, including embedded design centers, distributors and independent software vendors, the Qualcomm demonstrates its influence on the embedded and IoT ecosystem in segments such as robotics, manufacturing, edge AI devices, automotive solutions, among others. 6q6u5b
The company presented new features in its portfolio of products and solutions, seeking to empower its customers in the embedded ecosystem and preparing companies to meet the demands of the near future. In the presentation, the highlights were the new Qualcomm QCC730 Wi-Fi and the platform Qualcomm RB3 Gen 2. These innovations offer essential updates to enable AI on-device, high-performance processing with low power consumption, plus advanced connectivity for the latest IoT products and applications.
Qualcomm QCC730 4f4o1x
A Qualcomm began its presentation with the launch of Qualcomm QCC730, a Wi-Fi platform that promises to redefine connectivity for IoT devices. This technological innovation represents a significant leap in energy efficiency, offering an impressive reduction of up to 88% in energy consumption compared to previous generations.
Designed to meet the demands of industrial, commercial and battery-powered device applications, the QCC730 arrives on the market accompanied by an open source IDE and SDK. These additional tools facilitate development by ing the offloading of cloud connectivity, allowing for more fluid and efficient integration of devices.
But the versatility of QCC730 goes beyond. It presents itself as a high-performance alternative for Bluetooth-based IoT applications, opening the door to more flexible design and direct connection to the cloud. This ability to adapt and integrate is crucial in a constantly evolving market, where innovation and flexibility are essential to adapt to each new change in the industry and customer requirements. stakeholders of each project.
Rahul Patel, general manager of Connectivity, Broadband and Networks (CBN) group at Qualcomm Technologies, emphasized the strategic importance of QCC730 indicating that this SoC (System on Chip) is not just an evolution, but a true revolution in Wi-Fi connectivity for devices IoT battery powered. As QCC730, Qualcomm promotes a new level of possibilities for next-generation smart-home, healthcare, gaming and consumer electronics devices. Second, the company's manager, the launch reflects the company's ongoing commitment Qualcomm in utilizing our extensive research and development track record to create pioneering and transformative experiences.
Technical specifications – Qualcomm QCC730
| U | Cortex-M4F processor with FPU @ 60 MHz 1.5 MB RRAM (600 KB for Applications) 640 KB SRAM (260 KB for Applications) XiP over QSPI Flash |
| Wi-Fi | 1×1, 2.4/5GHz, 802.11a/b/g/n, HT20, up to MCS3 |
| Safety | Cryptographic Accelerator Secure Boot Qualcomm Trusted Execution Environment (TEE) Secure debug |
| Interface | 15x GPIO (muxed), SPI, Master QSPI, Master I2C, UART (2-wire) |
| Package Type | 3.3 x 3.58 x 0.55 mm, 0.35 mm pitch, 90-ball WLCSP 22ULL process node |
Qualcomm RB3 Gen 2 l493w
Another highlight of his presentation was the launch of Qualcomm RB3 Gen 2, its new platform that promises to raise the standard in IoT and embedded solutions. This new solution announced by the company, both in hardware and software, promises to meet growing market demands, offering exceptional performance and advanced features for a variety of applications.
Equipped with the processor Qualcomm QCS6490, RB3 Gen 2 combines high-performance processing with an impressive 10x increase in AI processing on-device. Additionally, the platform s up to four 8MP+ camera sensors, computer vision, and integrated Wi-Fi 6E. This versatility allows the RB3 Gen 2 be adopted in a wide range of products, including robots, drones, portable industrial devices, industrial and connected cameras, AI edge boxes, smart displays and more.
To facilitate development and integration, the platform RB3 Gen 2 is now available for pre-order in two integrated development kits, Core Kit e Vision Kit. Additionally, it s able software updates, simplifying the process of app development, integration, and prototyping and proof-of-concept creation.
One of the characteristics of RB3 Gen 2 is to Qualcomm AI Hub, which provides a library of pre-optimized and continually updated AI models. This provides an out-of-the-box optimized experience across a range of AI models widely used in IoT and embedded applications. Developers will be able to choose from a selection of templates for RB3 Gen 2 and integrate these optimized AI models into your applications, reducing time to market and leveraging the benefits of AI implementations on-device, such as immediacy, reliability, privacy, personalization and cost savings.
A RB3 Gen 2 also stands out for its for Qualcomm Linux, a software solution that includes operating system, tools and documentation, specially designed for IoT platforms Qualcomm. This unified Linux software platform is compatible with all processor cores, subsystems and platform components RB3 Gen 2, providing a consistent, superior and more practical developer experience.
To further expand your expertise in open-source and accelerate the commercialization of products with the Qualcomm Linux, Qualcomm recently acquired the Foundries.io. According to the company, this acquisition strengthens the company's position in the market, offering a platform open-source Cloud-native that simplifies device development and updates IoT and edge systems based on Linux.
The Development Kit includes:
- Processor-based development board Qualcomm QCS6490
- 12V power source
- USB Type-C cable
- Mini speakers
- Configuration Guide
- Switch configuration tool
In addition, it has a camera system in its version Vision Kit for developments that require sensors.
This Vision Kit version is equipped with cutting-edge features to provide a superior photography and videography experience. The heart of this capability is the image processing engine Qualcomm Spectra ISP 570L, designed to deliver high-quality images and exceptional performance.
The development platform includes a main camera and a tracking camera on the Vision Kit, enabling a variety of advanced visual applications. Additionally, the platform has the ability to connect and process outputs from other cameras, such as stereo, depth and Time-of-Flight (ToF), further expanding your vision and perception capabilities.
For video capture and playback, the platform has a graphics processor Qualcomm Adreno 633 VPU, which offers high-quality UltraHD video encoding and decoding. This component ensures that moving images are captured and reproduced with stunning clarity and detail. Furthermore, the Adreno 1075 DPU (Display Processing Unit) of the platform enables for UltraHD display both on the device and on external monitors. This functionality is essential for industrial applications that require high-resolution, real-time quality visualization.
Technical specifications – Qualcomm RB3 Gen 2
| chipset | QCS 6490/XNUMX/XNUMX |
| U | Octa-core U |
| RAM memory | uM package (6GB LPDDR4x) |
| Camera | Core Kit: 2x C-PHY/D-PHY 30-pin expansion ports on interposer board Vision Kit: 1x IMX577 D-PHY 12 MP, 1x OV9282 D-PHY 1 MP with bracket, plus additional D-PHY and GMS- capable expansion ports |
| GPU | Adreno GPU 643 |
| Institutional | VPU: 4K60 fps decode / 4K30 fps encode |
| IA | 12 TOPS |
| Connectivity | 1x USB 3.0 Type-C, 1x USB 2.0 w/OTG, 2x USB 3.0 Type-A, 1x USB 3.0 |
The new era of industrial intelligence 4d4m6u
Finally, the Qualcomm announced at its event that it is preparing to usher in a new era with the launch of an industrial platform designed to meet the specific and rigorous demands of the market. This set of innovations represents a significant step in expanding the company's portfolio of IoT solutions. Qualcomm, focusing on functional safety, environmental and mechanical requirements in industrial applications.
Expected to be available in June 2024, this next-generation industrial platform will be certified for System Integrity Level (System Integrity Level) and the solution will be equipped with high-performance U, GPU and AI capabilities on-device, as well as advanced for camera security ISPs with for multiple simultaneous cameras and meeting industrial I/O needs.
We look forward to showcasing our latest technologies and collaborating with our partners to continue bringing you products IoT innovators for the industry. We are excited to introduce the RB3 Gen 2 Platform, designed to deliver advanced AI capabilities on-device for a wide range of applications IoT medium-sized. We will soon be expanding our product portfolio IoT to address high-performance, industrial-grade solutions that will usher in a new era of intelligence, functional safety and robust computing capabilities for the most demanding industrial applications.
Jeff Torrance, senior vice president and general manager of industrial IoT at Qualcomm Technologies.
With this new industrial platform, Qualcomm is increasingly proposing to lead the digital transformation of the industry, offering advanced solutions that combine performance, functional safety and artificial intelligence on-device to meet the complex and diverse needs of modern industrial applications.
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Source: Qualcomm
reviewed by Glaucon Vital in 8 / 4 / 24.
